| 序号 | 标准号 | 标准名称 |
 1 | IPC-6010 Series IPC-6010 | Qualification and Performance SeriesIPC-6010印制电路板质量标准和性能规范系列手册 |
| 2 | IPC-6011 | Generic Performance Specification for Printed Boards 印制板通用性能规范 |
| 3 | IPC-6013-K | Qualification & Performance Specification for Flexible Printed Boards (Includes Amendment 1) 挠性印制板的鉴定与性能规范（包括修改单1） |
| 4 | IPC-6016 | Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards 高密度互连(HDI)层或印制板的鉴定与性能规范 |
| 5 | IPC-6012A-AM | Qualification and Performance Specification for Rigid Printed Boards Includes Amendment 1 刚性印制板的鉴定与性能规范 (包括修改单1) |
| 6 | IPC-6018A | Microwave End Product Board Inspection and Tech 微波成品印制板的检验和测试 |
| 7 | IPC-6015 | Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnections 有机多芯片模块(MCM-L)安装及互连结构的鉴定与性能规范 |
| 8 | IPC-A-600F | Acceptability of Printed Boards 印制板验收条件 |
| 9 | IPC-QE-605A | Printed Board Quality Evaluation Handbook 印制板质量评价 |
| 10 | IPC-QE-605A-KIT | Hard Copy and CD 印制板质量评价书和光盘(CD) |
| 11 | IPC-HM-860 | Specification for Multilayer Hybrid Circuits多层混合电路规范 |
| 12 | IPC-TF-870 | Qualification and Performance of Polymer Thick Film Printed Boards聚合物厚膜印制板的鉴定与性能 |
| 13 | IPC-ML-960 | Qualification and Performance Specification for Mass Lamination Panels for Multilayer printed Boards 多层印制板的鉴定与性能规范用预制内层在制板的鉴定与性能规范 |
| 14 | IPC-TR-481 | Results of Multilayer Tests Program Round Robin多层印制板联合试验计划结果 |
| 15 | IPC-TR-551 | Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components 用于电子元件安装与互连的印制板质量评价 |
| 16 | IPC-TR-579 | Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PCBs 印制板中小直径镀覆孔可靠性评价联合试验 |
| 17 | IPC-4552 | Specification for Electroless Nickel/Immersion Gold(ENIG) Plating for Printed Circuit Boards 印制电路板表面非电镀镍/沉金规范 |
| 18 | IPC-DR-572 | Drilling Guidelines for Printed Boards 印制板钻孔导则 |
| 19 | IT-95080 | Improvements/Alternatives to Mechanical Drilling of PCB Vias印制板通孔机加工方案的改进和优选手册 |
| 20 | IPC-NC-349 | Computer Numerical Control Formatting for Drillers and Routers钻床和铣床用计算机数字控制格式 |
| 21 | IPC-SM-839 | Pre & Post Solder Mask Application Cleaning Guidelines施加阻焊前及施加后清洗导则 |
| 22 | IPC-HDI-1 | High Density Interconnect Microvia Technology Compendium高密度(HDI)互连微通孔技术纲要 |
| 23 | IPC/JPCA-4104 | Specification for High Density Interconnect (HDI) and Microvia Materials高密度互连(HDI)及微导通孔材料规范 |
| 24 | IPC/JPCA-6801 | IPC/JPCA Terms & Definitions Test Methods and Design Examples for Build-Up/High Density Interconnection 积层/高密度互连的术语和定义、试验方法与设计例 |
| 25 | IPC-DD-135 | Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules 多芯片组件内层有机绝缘材料的鉴定试验 |
| 26 | IT-96060 | High Density PCB Microvia Evaluation (October Project) Phase I Round 1高密度印制板微通孔评价指标手册 第一期第一版 |
| 27 | IT-97071 | High Density PCB Microvia Evaluation Phase I Round 2高密度印制板微通孔评价指标手册 第一期第二版 |
| 28 | IT-30101 | High Density PCB Microvia Evaluation Phase I Round 3高密度印制板微通孔评价指标手册 第一期第三版 |
| 29 | IT-98123 | Microvia Manufacturing Technology Cost Analysis Report微通孔制作技术成本核算报告 |
| 30 | IPC-2141 | Controlled Impedance Circuit Boards & High Speed Logic Design控制阻抗电路板与高速逻辑设计 |
| 31 | IPC-2252 | Design Guide for RF/Microwave Circuit Boards 射频/微波电路板设计指南 |
| 32 | IPC-4103 | Specification for Base Materials for High Speed/High Frequency Applications 高速高频用基材规范 |