| 序号 | 标准号 | 标准名称 |
 1 | IPC-ML-950 | Performance Specification for Rigid Multilayer Printed Boards |
| 2 | IPC-ML-975 | End Product Documentation Specification for Multilayer Printed Wiring Boards |
| 3 | IPC-ML-990 | Performance Specification for Flexible Multilayer Wiring |
| 4 | IPC-1043 | Cleaning & Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 1 |
| 5 | IPC-1044 | Cleaning & Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 2 |
| 6 | IPC-1065 | Material Declaration Handbook |
| 7 | IPC-1066 | Labeling of PCBs and Assemblies |
| 8 | IPC-TP-1103 | Manufacturing Concerns When Soldering with Gold Plated Component Leads or Circuit Board Pads |
| 9 | IPC-1131 | IT Guidelines for PWB Manufacturers |
| 10 | IPC-1331 | Voluntary Safety Standard for Electrically Heated Process Equipment |
| 11 | IPC-1710 | OEM Standard for Printed Board Manufacturers Qualification Profile (MQP) |
| 12 | IPC-1720 | Assembly Qualification Profile (AQP) |
| 13 | IPC-1730 | Laminator Qualification Profile (LQP) |
| 14 | IPC-1731 | Strategic Raw Materials Supplier Qualification Profile |
| 15 | IPC-1751 | Generic Requirements for Declaration Process Management |
| 16 | IPC-1752 | Materials Declaration Management (Includes 2 PDF forms) |
| 17 | IPC-2221 | Generic Standard on Printed Board Design |
| 18 | IPC-2251 | Design Guidelines for Electronic Packaging Utilizing High Speed Techniques |
| 19 | IPC-2316 | Design Guide for Embedded Passive Device Printed Boards |
| 20 | IPC-2511 | Generic Requirements for Implementation of Product Manufacturing Description Data and Transfer Methodology |
| 21 | IPC-2512 | Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description |
| 22 | IPC-2513 | Sectional Requirements for Implementation of Drawing Methods for Manufacturing Data Description |
| 23 | IPC-2514 | Sectional Requirements for Implementation of Printed Board Manufacturing Data Description |
| 24 | IPC-2515 | Sectional Requirements for Implementation of Bare Board Product Electrical Testing Data Description |
| 25 | IPC-2516 | Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description |
| 26 | IPC-2517 | Sectional Requirements for Implementation of Assembly In-Circuit Testing Data Description – 2-11gChair Bob Neal Agilent Technologies |
| 27 | IPC-2518 | Sectional Requirements for Implementation of Part List Product Data Description - Chair Harry Parkinson Parkinson Consulting |
| 28 | IPC-2524 | PWB Fabrication Data Quality Rating System |
| 29 | IPC-2581 | Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology (Offspring) |
| 30 | IPC-2582 | Sectional Requirements for Implementation of Design Characteristics for Manufacturing Data Description |
| 31 | IPC-2583 | Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description |
| 32 | IPC-2584 | Sectional Requirements for Implementation of Printed Board Fabrication Data Description |
| 33 | IPC-2588 | Sectional Requirements for Implementation of Part List Product Data Description |
| 34 | IPC-4101 | Specification for Base Materials for Rigid and Multilayer Boards |
| 35 | IPC-4411 | Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement |
| 36 | IPC-4553 | Specification for Immersion Silver Plating for Printed Circuit Boards |
| 37 | IPC-4554 | Specification for Immersion Tin Plating for Printed Circuit Boards |
| 38 | IPC-4761 | Design Guide for Protection of Printed Board Via Structure |
| 39 | IPC-4821 | Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards |
| 40 | IPC-5701 | Users Guide for Cleanliness of Unpopulated Printed Boards |
| 41 | IPC-5702 | Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards |
| 42 | IPC-6012 | Qualification and Performance Specification for Rigid Printed Boards |
| 43 | IPC-6013 | Qualification and Performance Specification for Flexible Printed Boards |
| 44 | IPC-6018 | Microwave End Product Board Inspection and Test |
| 45 | IPC-7526 | Stencil and Misprinted Board Cleaning Handbook |
| 46 | IPC-7351 | Generic Requirements for Surface Mount Design and Land Pattern Standard |
| 47 | IPC-7711/7721 | Rev B renamed to:Rework Repair and Modification of Electronic Assemblies |
| 48 | IPC-8413-1 | Specification for Manufacturing Process Carriers for Handling Optical Fiber |
| 49 | IPC-9151 | Printed Board Capability Quality and Relative Reliability (PCQR2) Benchmark Test Standard and Database |
| 50 | IPC-9194 | Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline |
| 51 | IPC-9251 | Test Vehicles for Evaluating Fine Line Capability |
| 52 | IPC-9502 | PWB Assembly Soldering Process Guidelines for Non-IC Electronic Components |
| 53 | IPC-9591 | Performance Parameters (Mechanical Electrical Environmental and Quality/Reliability) for Air Moving Devices |
| 54 | IPC-9691 | User Guide for the IPC-TM-650 Method 2625 Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing) |
| 55 | IPC/JEDEC-9702 | Monotonic Bend Characterization of Board-Level Interconnects |
| 56 | IPC-SMEMA-9851 | Equipment Interface Specification |
| 57 | IPC-DRM-SMT | Surface Mount Solder Joint Evaluation Desk Reference Manual |
| 58 | IPC-EMSI-TC | IPC Sample Master Ordering Agreement for EMS Companies and OEMs |
| 59 | IPC-2221A | Generic Standard on Printed Board Design 印制板设计通用标准 |
| 60 | IPC-2222 | Sectional Standard on Rigid Organic Printed Boards刚性有机印制板设计分标准 |
| 61 | IPC-2223 | Sectional Design Standard for Flexible Printed Boards挠性印制板设计分标准 |
| 62 | IPC-2224 | Sectional Standard of Design of PWB for PC Card PC卡用印制电路板分设计分标准 |
| 63 | IPC-2225 | Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies 有机多芯片模块(MCM-L)及其组装件设计分标准 |
| 64 | IPC-2226 | Sectional Design Standard for High Density Interconnect (HDI) Printed Boards高密度互连(HDI)印制板设计分标准 |
| 65 | IPC-SM-782A | Surface Mount Design and Land Pattern Standard--Includes Amendments 1 & 2 表面安装设计及连接盘图形标准(包括修订1和2) |
| 66 | IPC-EM-782 | Surface Mount Design & Land Pattern Standard Spreadsheet表面安装设计及连接盘图形标准 |
| 67 | IPC-D-859 | Design Standard for Thick Film Multilayer Hybrid Circuits厚膜多层混合电路设计标准 |
| 68 | IPC-1902 | IPC/IEC Grid Systems for Printed Circuits IPC/IEC印制电路网格体系 |
| 69 | SMC-WP-004 | Design for Success 成功的综合设计分析手册 |
| 70 | IPC-PWB-EVAL-CH | Printed Circuit Board Defect Evaluation Chart 印制板缺陷评估图册 |
| 71 | IPC/JPCA-2315 | Design Guide for High Density Interconnects & Microvias高密度互连(HDI)和微通孔设计指南 |
| 72 | IPC-2615 | Printed Board Dimensions and Tolerances 印制板尺寸和公差 |
| 73 | IPC-A-311 | Process Controls for Phototool Generation and Use照相版制作和使用的过程控制 |
| 74 | IPC-D-279 | Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies 高可靠表面安装印制板组装件技术设计导则 |
| 75 | IPC-D-310C | Guidelines for Phototool Generation and Measurement Techniques照相版制作指南和测量技术 |
| 76 | IPC-D-322 | Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes使用标准在制板尺寸的印制板尺寸选择指南 |
| 77 | IPC-D-422 | Design Guide for Press Fit Rigid Printed Board Back Plane压配合刚性印制背板设计指南 |
| 78 | IPC-PWB ADV-CD (CD) PCB | Advanced Designer Certification Study Guide印制电路板高级设计师证书学习指南和多媒体光盘 |
| 79 | IPC-PWB-CERTCD1 (CD) PCB | Designer Certification Study Guide 印制电路板设计师证书学习指南和多媒体光盘 |
| 80 | IPC-2531 | Standard Recipe File Format SpecificationSMEMA发布： 标准“菜单”（过程控制）文件格式规范注：SMEMA{The Surface Mount Equipment Manufacturers Association merged with IPC} |
| 81 | IPC-2541 | Generic Requirements for Electronics Manufacturing Shop Floor Equipment Communication电子制造车间现场设备信息沟通(CAMX)通用要求 |
| 82 | IPC-2546 | Sectional Requirements for Specific Printed Circuit Board Assembly Equipment特殊印制板组装设备分要求 |
| 83 | IPC-2547 | Sectional Requirements for Shop Floor Electronic Inspection and Test Equipment Communication 车间现场电子检验及测试设备信息沟通分要求 |
| 84 | IPC-2571 | Generic Requirements for Electronics Manufacturing Supply Chain Communication - Product Data eXchange (PDX) 电子制造供应链信息沟通分要求 产品数据交换 |
| 85 | IPC-2576 | ectional Requirements for Electronics Manufacturing Supply Chain Communication of As-Built Product Data – Product Data eXchange 制成态产品-产品数据电子制造供应链信息沟通分要求 |
| 86 | IPC-2578 | Sectional Requirements for Supply Chain Communication of Bill of Material and Product Design Configuration Data-Product Data eXchange 材料单及产品设计构造数据-产品数据交换供应链信息沟通分要求 |
| 87 | IPC-2511A | Generic Requirements for Implementation of Product Manufacturing DescriptionData & Transfer Methodology 实施产品制造数据描述及其传输方法学的通用要求 |
| 88 | IPC-2501 | Definition for Web-Based Exchange of XML Data XML数据网络交换定义 |
| 89 | IPC-2511B | Generic Requirements for Implementation of Product Manufacturing Description Data & Transfer XML Schema Methodology实施产品制造数据描述及其网络传输方法学的通用要求 |
| 90 | IPC-2512A | Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description 实施制造数据描述管理方法的分要求 |
| 91 | IPC-2513A | Sectional Requirements for Implementation of Drawing Methods for Manufacturing Data Description 实施制造数据描述绘制方法的分要求 |
| 92 | IPC-2514A | Sectional Requirements for Implementation of Printed Board Manufacturing Data Description 实施印制板制造数据描述的分要求 |
| 93 | IPC-2515A | Sectional Requirements for Implementation of Bare-Board Product Testing Data Description 实施裸板成品测试数据描述的分要求 |
| 94 | IPC-2516A | Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description 实施已组装板制造数据描述的分要求 |
| 95 | IPC-2517A | Sectional Requirements for Implementation of Assembly In-Circuit Test Data Description 实施组装件在线测试数据描述的分要求 |
| 96 | IPC-2518A | Sectional Requirements for Implementation of Parts List Product Manufacturing Data Description 实施零部件制造数据描述的分要求 |
| 97 | IPC-D-356B | Bare Board Electrical Test Data Format 裸基板电检测的数据格式 |
| 98 | IPC-M-105 | Rigid Printed Board Manual 刚性印制板设计手册 |
| 99 | IPC-D-325A | Documentation Requirements for Printed Boards 印制板设计文件图册要求 |
| 100 | IPC-PE-740A | Troubleshooting for Printed Board Manufacture and Assembly印制板制造和组装的故障排除 |