| 序号 | 标准号 | 标准名称 |
 1 | IPC-L-109 | Specification for Resin Impregnated Fabric (Pregreg) for Multilayer Printed Boards |
| 2 | IPC-L-110 | Preimpregnated B-Stage Epoxy-Glass Cloth for Multilayer Printed Circuit Boards |
| 3 | IPC-CC-110 | Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications |
| 4 | IPC-L-112 | Specification for Composite Metal Clad Base materials for Printed Boards |
| 5 | IPC-L-115 | Specification for Rigid Metal Clad Base Materials for Printed Boards |
| 6 | IPC-L-120 | Inspection Procedure for Chemical Processing Suitability of Copper-Clad Epoxy-Glass Laminates |
| 7 | IPC-L-125 | Specifications for Plastic Substrates Clad or Unclad for High Speed/High Frequency Interconnections |
| 8 | IPC-L-130 | Specifications for Thin Laminates Metal Clad Primarily for General-Purpose Multilayer Printed Boards |
| 9 | IPC-EG-140 | Specification for Finished Fabric Woven from "E" Glass for Printed Boards |
| 10 | IPC-CF-148 | Resin Coated Metal for Printed Boards |
| 11 | IPC-MF-150 | Metal Foil for Printed Wiring Applications |
| 12 | IPC-CF-152 | Composite Metallic Material Specification for Printed Wiring Boards |
| 13 | IPC-FC-203 | Specification for Flat Cable Round Conductor Ground Plane |
| 14 | IPC-FC-210 | Performance Specification for Flat-Conductor Undercarpet Power Cable (Type FCC) |
| 15 | IPC-FC-213 | Performance Specification for Flat Undercarpet Telephone Cable |
| 16 | IPC-FC-217 | General Document for Connectors Electric Header ReceptacleInsulation Displacement for Use with Round Conductor Flat Cable |
| 17 | IPC-FC-218B/EIA-RS-429 | General Specification for Connectors Electrical Flat Cable Type |
| 18 | IPC-FC-219 | Environment Sealed Flat Cable Connectors for use in Aerospace Applications |
| 19 | IPC-FC-220 | Specification for Flat Cable Flat Conductor Unshielded |
| 20 | IPC-FC-221 | Specification for Flat-Copper Conductors for Flat Cables |
| 21 | IPC-FC-222 | Specification of Flat Cable Round Conductor Unshielded |
| 22 | IPC-FC-225 | Flat Cable Design Guide |
| 23 | IPC-FC-231 | Flexible Base Dielectrics for Use in Flexible Printed Wiring |
| 24 | IPC-FC-232 | Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Wiring and Flexible Bonding Films |
| 25 | IPC-FC-233 | Flexible Adhesive Bonding Films |
| 26 | IPC-FC-240 | Single sided flex |
| 27 | IPC-FC-241 | Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Wiring |
| 28 | IPC-RF-245 | Performance Specification for Rigid-Flex Printed Boards |
| 29 | IPC-D-249 | Design Standard for Flexible Single-and Double-Sided Printed Boards |
| 30 | IPC-FC-250A | Specification for Single - and Double-Sided Flexible Printed Wiring |
| 31 | IPC-D-275 | Design Standard for Rigid Printed Boards and Rigid Printed Board Assemblies |
| 32 | IPC-RB-276 | Qualification and Performance Specification for Rigid Printed Boards |
| 33 | IPC-D-300 | Printed Board Dimensions and Tolerances |
| 34 | IPC-D-310 | Guidelines for Phototool Generation and Measurement Techniques |
| 35 | IPC-D-316 | Design Guide for Microwave Circuit Boards Utilizing Soft Substrates |
| 36 | IPC-D-317 | Design Guidelines for Electronic Packaging Utilizing High-Speed Techniques |
| 37 | IPC-HF-318 | Microwave End Product Board Inspection and Test |
| 38 | IPC-D-319 | Design Standard for Rigid Single-and Double-Sided Printed Boards |
| 39 | IPC-SD-320 | Performance Specification for Rigid Single- and Double-Sided Printed Boards |
| 40 | IPC-MC-324 | Performance Specifications for Metal Core Boards |
| 41 | IPC-D-325 | Documentation Requirements for Printed Boards Assemblies and Support Drawings |
| 42 | IPC-D-326 | Information Requirements for Manufacturing Printed Board Assemblies |
| 43 | IPC-D-330 | Design Guide Manual |
| 44 | IPC-D-350 | Printed Board Description in Digital Form; Technical Content Identical to IEC-61182-1 |
| 45 | IPC-D-351 | Printed Board Drawings in Digital Form |
| 46 | IPC-D-352 | Electronic Design Data Description for Printed Boards in Digital Form |
| 47 | IPC-D-354 | Library Format Description for Printed Boards in Digital Form |
| 48 | IPC-D-355 | Printed Board Assembly Description in Digital Form |
| 49 | IPC-D-356 | Bare Board Electrical Test Information in Digital Form |
| 50 | IPC-AM-361 | Specification for Rigid Substrates for Additive Process Printed Boards |
| 51 | IPC-D-390 | Automated Design Guidelines |
| 52 | IPC-C-406 | Design and Application Guidelines for Surface Mount Connectors |
| 53 | IPC-CI-408 | Design and Application Guidelines for the Use of Solderless Surface Mount Connectors |
| 54 | IPC-BP-421 | General Specification for Rigid Printed Board Backplanes with Press Fit Contacts |
| 55 | IPC-DW-424 | General Specification for Encapsulated Discrete Wire Interconnection Boards |
| 56 | IPC-DW-425 | Design and End Product Requirements for Discrete Wiring Boards |
| 57 | IPC-DW-426 | Specifications for Assembly of Discrete Wiring |
| 58 | IPC-TR-460 | Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards |
| 59 | IPC-TR-466 | Wetting Balance Standard Weight Comparison Test |
| 60 | IPC-TR-468 | Factors Affecting Insulation Resistance Performance of Printed Boards |
| 61 | IPC-TR-470 | Thermal Characteristics of Multilayer Interconnection Boards |
| 62 | IPC-TR-474 | An Overview of Discrete Wiring Techniques |
| 63 | IPC-TR-476 | How to Avoid Metallic Growth Problems on Electronic Hardware |
| 64 | IPC-TR-480 | Results of Multilayer Test Program Round Robin IV Phase I |
| 65 | IPC-TR-549 | Measles in Printed Wiring Boards |
| 66 | IPC-DR-570 | General Specification for 1/8 Inch Diameter Shank Carbide Drills for Printed Boards |
| 67 | IPC-TR-576 | Additive Process Evaluation |
| 68 | IPC-TR-578 | Leading Edge Manufacturing Technology Report - Resulting of a Round Robin Study on Minimum Conductor Width and Plated-Through Holes in Rigid Bare Copper Double-Sided Printed Wiring Boards |
| 69 | IPC-WP/TR-584 | IPC White Paper and Technical Report on Halogen-Free Materials used for Printed Circuit Boards and Assemblies |
| 70 | IPC-TR-585 | Time Temperature and Humidity Stress of Final Board Finish Solderability |
| 71 | IPC-A-600 | Acceptability of Printed Boards |
| 72 | IPC-SS-605 | Printed Board Quality Evaluation Slide Set |
| 73 | IPC-QE-605 | Printed Board Quality Evaluation Handbook |
| 74 | J-STD-609 | Marking and Labeling of Components PCBs and PCBAs to Identify Lead (Pb) Pb-Free and Other Attributes and Devices |
| 75 | IPC-A-610 | Acceptability of Electronic Assemblies |
| 76 | IPC-QE-615 | Assembly Quality Evaluation Handbook |
| 77 | IPC-AI-640 | Users Guidelines for Automated Inspection of Unpopulated Thick Film Hybrid Substrates |
| 78 | IPC-AI-641 | Users Guidelines for Automated Solder Joint Inspection |
| 79 | IPC-AI-642 | Users Guidelines for Automated Inspection of Artwork Interlayers and Unpopulated PWBs |
| 80 | IPC-OI-645 | Standard for Visual Optical Inspection Aids |
| 81 | IPC-ET-652 | Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards |
| 82 | IPC-QL-653 | Qualification of Facilities that Inspect/Test Printed Boards Components and Material |
| 83 | IPC-R-700 | Suggested Guidelines for Modification Rework and Repair of Printed Boards and Assemblies |
| 84 | IPC-TA-720 | Technology Assessment Handbook on Laminates |
| 85 | IPC-TA-721 | Technology Assessment Handbook on Multilayer Boards |
| 86 | IPC-PE-740 | Troubleshooting Guide for Printed Board Manufacture and Assembly |
| 87 | IPC-CM-770 | Printed Board Component Mounting |
| 88 | IPC-SM-782 | Surface Mount Design and Land Pattern Standard |
| 89 | IPC-SM-786 | Procedures for Characterizing and Handling of Moisture/ Reflow Sensitive ICs |
| 90 | IPC-S-804 | Solderability Test Methods for Printed Wiring Boards |
| 91 | IPC-S-805 | Solderability Tests for Component Leads and Terminations |
| 92 | IPC-S-815 | General Requirements for Soldering Electronic Interconnections |
| 93 | IPC-S-816 | SMT Process Guideline and Checklist |
| 94 | IPC-SF-818 | General Requirement for Electronic Soldering Fluxes |
| 95 | IPC-SP-819 | General Requirements and Test Methods for Electronic Grade Solder Paste |
| 96 | IPC-CC-830 | Qualification and Performance of Electronic Insulating Compound for Printed Board Assemblies |
| 97 | IPC-SM-840 | Qualification and Performance of Permanent Polymer Coating (Solder Mask) for Printed Boards |
| 98 | IPC-H-855 | Hybrid Microcircuit Design Guide |
| 99 | IPC-ML-910 | Design and End Production Specification for Rigid Multilayer Printed Boards |
| 100 | IPC-D-949 | Design Standard for Rigid Multilayer Printed Boards |