| 序号 | 标准号 | 标准名称 |
 1 | IPC-SM-817 | General Requirements for Dielectric Surface Mounting Adhesives表面安装用介电粘接剂通用要求 |
| 2 | IPC-CA-821 | General Requirements for Thermally Conductive Adhesives导热胶粘剂通用要求 |
| 3 | IPC-3406 | Guidelines for Electrically Conductive Surface Mount Adhesives表面贴装导电胶使用指南 |
| 4 | IPC-3408 | General Requirements for Anisotropically Conductive Adhesives Films各向异性导电胶膜的一般要求 |
| 5 | IPC-CC-830B | Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies 印制板组装电气绝缘性能和质量手册 |
| 6 | IPC-HDBK-830 | Guideline for Design Selection and Application of Conformal Coatings敷形涂层的设计，选择和应用手册 |
| 7 | IPC-SM-840C | Qualification and Performance of Permanent Solder Mask - Includes Amendment 1永久性阻焊剂的鉴定及性能(包括修改单1) |
| 8 | IPC-HDBK-840 | Guide to Solder Paste Assessment 焊膏性能评价手册 |
| 9 | IPC-TP-1114 | The Layman’s Guide to Qualifying a Process to J-STD-001基于J-STD-001组装工艺雷氏选择法 |
| 10 | IPC-TR-467 | Supporting Data & Numerical Examples for J-STD-001 (Control of Fluxes) J-STD-001(焊剂控制)的支持数据及数字实例 |
| 11 | IPC-AJ-820 | Assembly & Joining Handbook 装联手册 |
| 12 | IPC-7530 | Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes 大规模焊接(回流焊与波峰焊)过程温度曲线指南 |
| 13 | IPC-9701 | Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments 表面安装锡焊件性能试验方法与鉴定要求 |
| 14 | IPC-TP-1090 | The Layman’s Guide to Qualifying New Fluxes 新型助焊剂雷氏选择法 |
| 15 | IPC-TP-1115 | Selection and Implementation Strategy for a Low-Residue No-Clean Process 低残留不清洗工艺的选择和实施 |
| 16 | IPC-S-816 SMT | Process Guideline & Checklist 表面安装技术过程导则及检核表 |
| 17 | IPC-TR-460A | Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards印制板波峰焊故障排除检查表 |
| 18 | IPC-CM-770D | Component Mounting Guidelines for Printed Boards印制板元件安装导则 |
| 19 | IPC-7912 | Calculation of DPMO & Manufacturing Indices for Printed Board Assemblies印制板和电子组装件每百万件缺陷数(DPMO)和制造指数的计算 |
| 20 | IPC-9261 | In-Process DPMO and Estimated Yield for PWAs 印制板组装过程中每百万件缺陷数(DPMO)及合格率估计 |
| 21 | IPC-9501 | PWB Assembly Process Simulation for Evaluation of Electronic Components 电子元件的印制板组装过程模拟评价 |
| 22 | IPC-9502 PWB | Assembly Soldering Process Guideline for Electronic Components电子元件的印制板组装焊接过导则 |
| 23 | IPC-9503 | Moisture Sensitivity Classification for Non-IC Components非集成电路元件的湿度敏感度分级 |
| 24 | IPC-9504 | Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components) 非集成电路元件的组装过程模拟评价（非集成电路元件预处理） |
| 25 | IPC-9850-K | Surface Mount Placement Equipment Characterization-KIT表面贴装设备性能检测方法的描述（附Gerber格式CD盘） |
| 26 | IPC-9850-TM-KW, IPC-9850-TM-K | Test Materials Kit for Surface Mount Placement Equipment Standardization 表面贴装设备性能测试用的标准工具包• |
| 27 | IPC-9850 | Placement Accuracy Verification Panels• 1 IPC-9850 CMM Measurement Verification Panels• |
| 28 | PC-9850 | QFP-100 Glass Components• 130 IPC-9850 QFP-208 Glass Components• 150 IPC-9850 BGA-228 Glass Components• NIST Traceable Measurement Certificate• Custom Storage Case |
| 29 | IPC-7711/21 7711 & 7721 | Package 合订本 |
| 30 | IPC-7711 | Rework of Electronic Assemblies 电子组装件的返工 |
| 31 | IPC-7721 | Repair and Modification of Printed Boards and Electronic Assemblies印制板和电子组装件的修复与修正 |
| 32 | IPC/EIA J-STD-002B | Solderability Tests for Component Leads Terminations Lugs Terminals and Wires 元件引线、端子、焊片、接线柱及导线可焊性试验 |
| 33 | IPC/EIA J-STD-003 | Solderability Tests for Printed Boards 印制板可焊性试验 |
| 34 | IPC-TR-461 | Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards印制板波峰焊故障排除检查表 |
| 35 | IPC-TR-462 | Solderability Evaluation of Printed Boards with Protective Coatings Over Long-term Storage 带保护性涂层印制板长期贮存的可焊性评价 |
| 36 | IPC-TR-464 | Accelerated Aging for Solderability Evaluations可焊性加速老化评价(附修订) |
| 37 | IPC-TR-465-1 | Round Robin Test on Steam Ager Temperature Control Stability蒸汽老化器温度控制稳定性联合试验 |
| 38 | IPC-TR-465-2 | The Effect of Steam Aging Time and Temperature on Solderability Test Results 蒸汽老化时间与温度对可焊性试验结果的影响 |
| 39 | IPC-TR-465-3 | Evaluation of Steam Aging on Alternative Finishes Phase IIA替代涂覆层的蒸汽老化评价 |
| 40 | IPC-TR-466 | Technical Report: Wetting Balance Standard Weight Comparison Test技术报告: 润湿天平称重标准对比测试 |
| 41 | SMC-WP-001 | Soldering Capability White Paper Report 可焊性工艺导论 |
| 42 | SMC-WP-005 | PCB Surface Finishes 印制电路板表面清洗 |
| 43 | IPC 1751-2005 | Generic Requirements for Declaration Process Management |
| 44 | IPC 1752-2005 | Materials Declaration Management |
| 45 | IPC 2221-1998 | Generic Standard on Printed Board Design |
| 46 | IPC 2222-1998 | Sectional Design Standard for Rigid Organic |
| 47 | IPC 2223-1998 | Sectional Design Standard for Flexible Printed Boards |
| 48 | IPC 4554-2005 | Specification for Immersion Tin Plating for Printed Circuit Boards |
| 49 | IPC-4553-1998 | Specification for Immersion Silver Plating for Printed Circuit Boards |
| 50 | IPC 6011-1996 | for Printed Circuit Boards for Printed Circuit Boards for Printed Circuit Boards |
| 51 | IPC 6012A-2000 | Qualification and Performance Specification for Rigid Printed Boards |
| 52 | IPC 6013-1998 | Qualification and Performance Specification for Flexible Printed Boards |
| 53 | IPC 6013-2003 | Qualification and Performance Specification for Flexible Printed Boards |
| 54 | IPC 6013A-2005 | Qualification and Performance Specification for Flexible Printed Boards |
| 55 | IPC 6015-1998 | Qualification and Performance Specification for Organic Multichip Module(MCM-L) Mounting and Interconnecting Structures |
| 56 | IPC 6016-1999 | QUalification and Performance Specification for High Density Interconnect(HDI) Layers or Boards |
| 57 | IPC 6018-1998 | Microwave End Product Board Inspection and Test |
| 58 | IPC 7711-1998 | Rework of Electronic Assy |
| 59 | IPC 9850-2001 | Surface Mount Equipment Characterization |
| 60 | J-STD-001 | Requirements for Soldered Electrical and Electronic Assemblies |
| 61 | J-STD-001CS | Space Applications Electronic Hardware Addendum for J-STD-001C |
| 62 | J-STD-001DS | Space Applications Electronic Hardware Addendum for J-STD-001D |
| 63 | SMC-TR-001 | An Introduction to Tape Automated Bonding Fine Pitch Technology |
| 64 | IT-WP-001 | Myths of E-Commerce |
| 65 | SMEMA 1.2 | Mechanical Equipment Interface Standard |
| 66 | JP002 | Current Tin Whiskers Theory and Mitigation Practices Guideline |
| 67 | J-STD-002 | Solderability Tests for Component Leads Terminations Lugs Terminals and Wires |
| 68 | SMC-WP-002 | An Assessment of the Use of Lead in Electronic Assembly |
| 69 | J-STD-003 | Solderability Tests for Printed Boards |
| 70 | SMEMA 3.1 | Fiducial Mark Standard |
| 71 | J-STD-004 | Requirements for Soldering Fluxes |
| 72 | SMEMA 4 | Reflow Terms and Definitions |
| 73 | J-STD-005 | Requirements for Soldering Pastes |
| 74 | SMC-WP-005 | Surface Finishes |
| 75 | SMEMA 5 | Screen Printing Terms and Definitions |
| 76 | J-STD-006 | Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications |
| 77 | SMEMA 6 | Electronics Cleaning Terms and Definitions |
| 78 | SMEMA 7 | Fluid Dispensing Terms and Definitions |
| 79 | WP-008 | Setting up Ion Chromatography Capability |
| 80 | J-STD-012 | Implementation of Flip Chip and Chip Scale Technology |
| 81 | IPC-DRM-18 | Component Identification Desk Reference Manual |
| 82 | J-STD-020 | Moisture/Reflow Sensitivity Classification of Plastic Surface Mount Devices |
| 83 | J-STD-026 | Semiconductor Design Standard for Flip Chip Applications |
| 84 | J-STD-028 | Performance Standard for Flip Chip Scale Bumps |
| 85 | J-STD-030 | Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages |
| 86 | J-STD-032 | Performance Standard for Ball Grid Array Bumps and Columns |
| 87 | J-STD-033 | Packaging and Handling of Moisture Sensitive Non-Hermetic Solid State Surface Mount Devices |
| 88 | J-STD-035 | Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components |
| 89 | IPC-0040 | Standards Roadmap for Optoelectronic Assembly and Packaging Technology |
| 90 | IPC-DRM-PTH | Through-Hole Solder Joint Evaluation Desk Reference Manual |
| 91 | IPC-T-50 | Terms and Definitions Interconnecting and Packaging Electronic Circuits |
| 92 | IPC-SC-60 | Post Solder Solvent Cleaning Handbook |
| 93 | IPC-AC-62 | Post Solder Aqueous Cleaning Handbook |
| 94 | IPC-CH-65 | Guidelines for Cleaning of Printed Boards and Assemblies |
| 95 | IPC-CS-70 | Guidelines for Chemical Handling Safety in Printed Board Manufacturing |
| 96 | IPC-CM-78 | Guidelines for Surface Mounting and Interconnecting Chip Carriers |
| 97 | IPC-MP-83 | IPC Policy on Metrication |
| 98 | IPC-PC-90 | General Requirements for Implementation of Statistical Process Control |
| 99 | IPC-QS-95 | General Requirements for Implementation of ISO 9000 Quality Systems |
| 100 | IPC-L-108 | Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards |