Description:
SEMI is the global industry association serving the advanced manufacturing supply chain. Semiconductor Equipment and Materials International (SEMI) is a trade organization of manufacturers of equipment and materials used in the fabrication of semiconductor devices such as integrated circuits, transistors, diodes, and thyristors. A global industry association serving the advanced manufacturing supply chain, SEMI acts as a clearinghouse for the generation of electronic standards. The documents within the SEMI give guidance on the chemical and material processes involved in the manufacture of semiconductor "chips" and other related devices.
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SEMI AUX1- 0699 |
List of Vendor Identification Codes |
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SEMI C1.21- 92 |
Standard for Xylenes |
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SEMI C10- 0299 |
Guide for Determination of Method Detection Limits |
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SEMI C13- 95 |
Test Method for Particle Shedding and Penetration Performance of Point- of-Use Gas Filters |
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SEMI C14- 95 |
Test Method for Particle Shedding Performance of 25 cm Gas Filter Cartridges |
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SEMI C15- 95 |
Test Method for PPM and PPB Humidity Standards |
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SEMI C16- 0299 |
Guide for Precision and Data Reporting Practices |
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SEMI C18- 0699 |
Specification for Acetic Acid |
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SEMI C19- 0699 |
Specification for Acetone |
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SEMI C1- 95 |
Specifications for Reagents |
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SEMI C20- 0699 |
Specification and Guidelines for Ammonium Fluoride 40% |
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SEMI C21- 0699 |
Specifications and Guideline for Ammonium Hydroxide |
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SEMI C22- 0699 |
Guideline for Boron Tribromide |
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SEMI C23- 0699 |
Specifications for Buffered Oxide Etchants |
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SEMI C24- 0699 |
Specification for n-Butyl Acetate |
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SEMI C25- 0699 |
Specification for Dichloromethane (Methylene Chloride) |
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SEMI C26- 0699 |
Specification and Guideline for Hexamethyldisilazane (HMDS) |
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SEMI C27- 0699 |
Specifications and Guidelines for Hydrochloric Acid |
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SEMI C28- 0699 |
Specifications and Guidelines for Hydrofluoric Acid |
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SEMI C29- 0699 |
Specifications and Guidelines for 4.9% Hydrofluoric Acid (10:1 v/v) |
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SEMI C2- 95 |
Specifications for Etchants |
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SEMI C3.10- 95 |
Standard for Silane (SiH4) (Provisional) |
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SEMI C3.11- 93 |
Standard for Silicon Tetrachloride (SiCl4) in Cylinders (Provisional) |
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SEMI C3.12- 94 |
Standard for Ammonia (NH3) in Cylinders, 99.998% Quality |
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SEMI C3.13- 93 |
Standard for Nitrous Oxide (N2O) in Cylinders, 99.997% Quality |
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SEMI C3.14- 94 |
Standard for Argon (Ar), in Cylinders, 99.998% Quality |
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SEMI C3.15- 93 |
Standard for Nitrogen (N2) in Cylinders, 99.9992% Quality |
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SEMI C3.16- 95 |
Standard for Oxygen (O2) in Cylinders, 99.50% Assay |
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SEMI C3.18- 94 |
Standard for Dichlorosilane (H2SiCl2) in Cylinders, 97% Quality |
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SEMI C3.1- 93 |
Standard for Argon (Ar), Bulk Liquid, 99.998% Quality |
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SEMI C3.19- 93 |
Standard for Hydrogen (H2) in Cylinders, 99.9995% Quality |
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SEMI C3.20- 92 |
Standard for Helium (He) in Cylinders, 99.9995% Quality |
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SEMI C3.21- 90 |
Standard for Carbon Tetrafluoride (CF4) in Cylinders (Provisional) |
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SEMI C3.22- 93 |
Standard for Oxygen (O2), Bulk Liquid, 99.5% Quality |
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SEMI C3.23- 95 |
Standard for Oxygen (O2) in Cylinders, 99.98% Quality |
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SEMI C3.24- 95 |
Standard for Sulfur Hexafluoride (SF6) in Cylinders, 99.97% Quality |
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SEMI C3.26- 94 |
Standard for Tungsten Hexafluoride (WF6) in Cylinders, 99.8% Quality |
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SEMI C3.27- 94 |
Standard for Boron Trifluoride (BF3) in Cylinders, 99.0% Quality |
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SEMI C3.28- 92 |
Standard for Nitrogen (N2), VLSI Grade in Cylinders |
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SEMI C3.2- 92 |
Standard for Arsine (AsH3) in Cylinders |
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SEMI C3.29- 96 |
Standard for Nitrogen (N2), Bulk Gaseous, 99.9995% Quality |
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SEMI C3.30- 96 |
Standard for Hydrogen (H2), Bulk, 99.9997% Quality |
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SEMI C3.31- 94 |
Standard for Dichlorosilane (H2SiCl2) in Cylinders, 99% Quality (Provisional) |
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SEMI C3.32- 95 |
Standard for Chlorine (Cl2), 99.996% Quality |
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SEMI C3.33- 92 |
Standard for Boron Trichloride (BCI3) (Provisional) |
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SEMI C3.34- 92 |
Standard for Disilane (Si2H6) |
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SEMI C3.35- 95 |
Standard for Hydrogen Chloride (HCl), 99.997% Quality (Provisional) |
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SEMI C3.36- 94 |
Standard for Hydrogen Chloride (HCl), 99.994% Quality (Provisional) |
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SEMI C3.37- 93 |
Standard for Hexafluoroethane (C2F6), 99.97% Quality |
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SEMI C3.38- 89 |
Standard for Tungsten Hexafluoride (WF6), VLSI Grade (Provisional) |
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SEMI C3.39- 91 |
Standard for Nitrogen Trifluoride (NF3) (Provisional) |
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SEMI C3.40- 92 |
Standard for Carbon Tetrafluoride (CF4), VLSI Grade (Provisional) |
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SEMI C3.41- 0697 |
Standard for Oxygen (O2), Bulk, 99.9998% Quality (Provisional) |
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SEMI C3.42- 90 |
Standard for Argon (Ar), VLSI Grade Bulk (Provisional) |
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SEMI C3.43- 90 |
Standard for Hydrogen Fluoride (HF), Anhydrous (Provisional) |
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SEMI C3.44- 91 |
Standard for Diborane (B2H6) (Provisional) |
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SEMI C3.45- 92 |
Standard for Hexafluoroethane (C2F6), 99.996% Quality (Provisional) |
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SEMI C3.46- 93 |
Standard for Argon (Ar), Bulk Liquid, 99.9992% Quality |
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SEMI C3.47- 95 |
Standard for Hydrogen Bromide (HBr), 99.98% Quality |
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SEMI C3.48- 93 |
Standard for Nitrogen (N2), Bulk Liquid, 99.9994% Quality |
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SEMI C3.4- 93 |
Standard for Hydrogen (H2), Bulk Liquid, 99.9995% Quality |
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SEMI C3.49- 94 |
Standard for Bulk Nitrogen (N2), 99.99999% Quality |
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SEMI C3.50- 95 |
Standard for Nitrous Oxide (N2O), 99.9994% Quality (Provisional) |
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SEMI C3.51- 95 |
Standard for Boron Trichloride (BCl3), 99.98% Quality |
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SEMI C3.52- 95 |
Standard for Tungsten Hexafluoride, 99.996% Quality |
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SEMI C3.53- 95 |
Standard for Trifluoromethane (CHF3), 99.95% Quality |
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SEMI C3.54- 0697 |
Gas Purity Guideline for Silane (SiH4) |
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SEMI C3.5- 93 |
Standard for Nitrogen (N2), Bulk Liquid, 99.998% Quality |
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SEMI C3.6- 95 |
Standard for Phosphine (PH3) in Cylinders, 99.98% Quality (Provisional) |
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SEMI C30- 0699 |
Specifications and Guidelines for Hydrogen Peroxide |
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SEMI C3- 0699 |
Specifications for Gases |
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SEMI C31- 0699 |
Specification for Methanol |
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SEMI C32- 0699 |
Specification for Methyl Ethyl Ketone |
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SEMI C33- 0699 |
Specifications for n-Methyl 2-Pyrrolidone |
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SEMI C34- 0699 |
Specification and Guideline for Mixed Acid Etchants |
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SEMI C35- 0699 |
Specifications and Guideline for Nitric Acid |
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SEMI C36- 0699 |
Specifications and Guidelines for Phosphoric Acid |
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SEMI C37- 0699 |
Specification for Phosphoric Etchants |
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SEMI C38- 0699 |
Guideline for Phosphorus Oxychloride |
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SEMI C39- 0699 |
Specification for Potassium Hydroxide Pellets |
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SEMI C40- 0699 |
Specification for Potassium Hydroxide, 45% Solution |
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SEMI C41- 0699 |
Specifications and Guidelines for 2-Propanol |
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SEMI C42- 0699 |
Specification for Sodium Hydroxide Pellets |
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SEMI C43- 0699 |
Specification for Sodium Hydroxide, 50% Solution |
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SEMI C44- 0699 |
Specifications and Guidelines for Sulfuric Acid |
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SEMI C45- 0699 |
Specification and Guideline for Tetraethylorhosilicate (TEOS) |
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SEMI C46- 0699 |
Guideline for 25% Tetramethylammonium Hydroxide |
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SEMI C47- 0699 |
Guideline for Trans 1,2 Dichloroethylene |
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SEMI C48- 0699 |
Specification and Guideline for 1,1,1-Trichloroethane, Furnace Grade |
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SEMI C49- 0699 |
Guideline for Trimethylborate |
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SEMI C50- 0699 |
Guideline for Trimethylphosphite |
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SEMI C51- 0699 |
Specification for Xylenes |
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SEMI C6.2- 93 |
Particle Specification for Grade 20/0.02 Oxygen Delivered as Pipeline Gas |
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SEMI C6.3- 89 |
Particle Specification for Grade 20/0.2 Hydrogen (H2) Delivered as Pipeline Gas |
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SEMI C6.4- 90 |
Particle Specification for Grade 20/0.02 Nitrogen (N2) and Argon (Ar) Delivered as Pipeline Gas |
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SEMI C6.5- 90 |
Particle Specification for Grade 10/0.2 Nitrogen (N2) and Argon (Ar) Delivered as Pipeline Gas |
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SEMI C6.6- 90 |
Particle Specification for Grade 10/0.1 Nitrogen (N2) and Argon (AR) Delivered as Pipeline Gas |
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SEMI C6.7- 93 |
Particle Specification for Grade 10/0.2 Nitrogen in High Pressure Gas Cylinders |
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SEMI C9.1- 93 |
Guide for Analysis of Uncertainties in Gravimetrically Prepared Gas Mixtures |
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SEMI COMM |
Committee Descriptions and Current Development Activity; Regional Standards Committee Lists |
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SEMI COPY |
SEMI Copyright Information |
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SEMI D10- 95 |
Test Method for Chemical Durability of Flat Panel Display Glass Substrates |
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SEMI D11- 95 |
Specification for Flat Panel Display Glass Substrate Cassettes |
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SEMI D12- 95 |
Specification for Edge Condition of Flat Panel Display (FPD) Substrates |
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SEMI D13- 95 |
Terms and Definitions for FPD Color Filter Assemblies |
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SEMI D14- 96 |
Specification for Image Field Stitching Capabilities of FPD Steppers |
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SEMI D15- 1296 |
FPD Glass Substrate Surface Waviness Measurement Method |
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SEMI D16- 0998 |
Specification for Mechanical Interface Between Flat Panel Display Material Handling System and Tool Port |
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SEMI D17- 0998 |
Mechanical Specification for Cassettes Used to Ship Flat Panel Display Glass Substrates |
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SEMI D18- 0299 |
Specification for Cassettes Used for Horizontal Transport and Storage of Flat Panel Display Substrates |
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SEMI D19- 0299 |
Test Method for the Determination of Chemical Resistance of Flat Panel Display Color Filters |
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SEMI D3- 91 |
Quality Area Specification for Flat Panel Display Substrates |
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SEMI D4- 94 |
Method for Referencing Flat Panel Display Substrates |
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SEMI D5- 94 |
Standard Size for Flat Panel Display Substrates |
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SEMI D6- 0699 |
Specification for Edge Length and Thickness for Flat Panel Display Mask Substrates |
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SEMI D7- 94 |
FPD Glass Substrate Surface Roughness Measurement Method |
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SEMI D8- 94 |
Specification for Overlay Capabilities of FPD Steppers |
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SEMI D9- 94 |
Definitions for Flat Panel Display Substrates |
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SEMI DEF MASKS |
Definitions for Flat Panel Display Masks |
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SEMI DEFECT TERM |
Defect Terminology for FPD Masks |
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SEMI E/H- 0699 |
Equipment Automation/Hardware Volume |
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SEMI E/S 1- 0699 |
Equipment Automation/Software Volume 1 |
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SEMI E/S 2- 0699 |
Equipment Automation/Software Volume 2 |
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SEMI E1.1- 0697 |
Standard for 3 Inch Plastic and Metal Wafer Carriers, General Usage |
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SEMI E1.2- 0697 |
Standard for 100 mm Plastic and Metal Wafer Carriers, General Usage |
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SEMI E1.3- 0697 |
Standard for 125 mm Plastic and Metal Wafer Carriers, General Usage |
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SEMI E1.4- 0697 |
Standard for 125 mm Plastic and Metal Wafer Carriers, Auto Transport Usage |
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SEMI E1.5- 91 |
Standard for 150 mm Plastic and Metal Wafer Carriers, General Usage |
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SEMI E1.9- 0699 |
Provisional Mechanical Specification for Cassettes Used to Transport and Store 300-mm Wafers |
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SEMI E10- 0699 |
Standard for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) |
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SEMI E1- 0697 |
Specification for 3 Inch, 100 mm, 125 mm, and 150 mm Plastic and Metal Wafer Carriers |
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SEMI E11- 0697 |
Guideline for 125 mm, 150 mm, and 200 mm Plastic and Metal Wafer Carrier Application |
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SEMI E12- 96 |
Standard for Standard Pressure, Temperature, Density, and Flow Units Used in Mass Flow Meters and Mass Flow Controllers |
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SEMI E13- 91 |
Standard for SEMI Equipment Communication Standard Message Service (SMS)-NOTE: This document was balloted and approved for withdrawal in 1995 |
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SEMI E14- 93 |
Measurement of Particle Contamination Contributed to the Product from the Process or Support Tool |
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SEMI E15.1- 0699 |
Provisional Specification for 300 mm Tool Load Port |
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SEMI E15- 0698 |
Specification for Tool Load Port |
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SEMI E16- 90 |
Guideline for Determining and Describing Mass Flow Controller Leak Rates |
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SEMI E17- 91 |
Guideline for Mass Flow Controller Transient Characteristics Tests |
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SEMI E18- 91 |
Guideline for Temperature Specifications of the Mass Flow Controller |
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SEMI E19.1- 0697 |
Port Standard for Mechanical Interface of Wafer Cassette Transfer, 100 mm (4 Inch) Port |
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SEMI E19.2- 0697 |
Port Standard for Mechanical Interface of Wafer Cassette Transfer, 125 mm (5 Inch) Port |
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SEMI E19.3- 0697 |
Port Standard for Mechanical Interface of Wafer Cassette Transfer, 150 mm (6 Inch) Port |
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SEMI E19.4- 0998 |
200 mm Standard Mechanical Interface (SMIF) |
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SEMI E19.5- 0996 |
Specification for 300 mm Bottom-Opening Standard Mechanical Interface (SMIF) |
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SEMI E19- 0697 |
Standard Mechanical Interface (SMIF) |
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SEMI E2.2- 93 |
Standard for 200 mm Quartz and High Temperature Wafer Carriers |
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SEMI E2.3- 93 |
Standard for 100 mm Quartz and High Temperature Wafer Carriers |
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SEMI E2.4- 93 |
Standard for 125 mm Quartz and High Temperature Wafer Carriers |
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SEMI E2.5- 93 |
Standard for 150 mm Quartz and High Temperature Wafer Carriers |
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SEMI E20- 0697 |
Cluster Tool Module Interface: Electrical Power and Emergency Off Standard |
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SEMI E21.1- 1296 |
Cluster Tool Module Interface 300 mm: Mechanical Interface and Wafer Transport Standard |
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SEMI E21- 94 |
Cluster Tool Module Interface: Mechanical Interface and Wafer Transport Standard |
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SEMI E22.1- 1296 |
Cluster Tool Module Interface 300 mm: Transport Module End Effector Exclusion Volume Standard |
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SEMI E22- 0697 |
Cluster Tool Module Interface: Transport Module End Effector Exclusion Volume Standard |
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SEMI E23- 96 |
Specification for Cassette Transfer Parallel I/O Interface |
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SEMI E24- 92 |
Cluster Tool Module Interface: Isolation Valve Interlocks Standard |
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SEMI E25- 92 |
Cluster Tool Module Interface: Module Access Guideline |
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SEMI E26.1- 92 |
Radial Cluster Tool Footprint 300 mm Standard |
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SEMI E26- 92 |
Radial Cluster Tool Footprint Standard |
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SEMI E27- 92 |
Standard for Mass Flow Controller and Mass Flow Meter Linearity |
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SEMI E28- 92 |
Guideline for Pressure Specifications of the Mass Flow Controller |
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SEMI E2- 93 |
Specifications for Quartz and High Temperature Wafer Carriers |
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SEMI E29- 93 |
Standard Terminology for the Calibration of Mass Flow Controllers and Mass Flow Meters |
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SEMI E30.1- 0698 |
Inspection and Review Specific Equipment Model (ISEM) |
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SEMI E30.2- 0698 |
Handler Equipment Specific Equipment Model (HSEM) |
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SEMI E30.3- 0698 |
Testing Equipment Specific Equipment Model (TSEM) |
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SEMI E30.4- 0699 |
Intrabay AMHS SEM Specification (IBSEM) |
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SEMI E30- 0299 |
Generic Model for Communications and Control of SEMI Equipment (GEM) |
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SEMI E31- 93 |
Specification for Electrical Interface, Japan Only |
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SEMI E32.1- 0997 |
SECS-II Support for Material Movement |
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SEMI E32- 0997 |
Material Movement Management (MMM) |
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SEMI E33- 94 |
Specification for Semiconductor Manufacturing Facility Electromagnetic Compatibility |
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SEMI E34- 95 |
Guideline for Mass Flow Device Return |
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SEMI E35.1- 95 |
Guide for Cost of Equipment Ownership Comparison Metric |
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SEMI E35- 0299 |
Cost of Ownership for Semiconductor Manufacturing Equipment Metrics |
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SEMI E36- 0699 |
Semiconductor Equipment Manufacturing Information Tagging Specification |
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SEMI E37.1- 96 |
High-Speed SECS Message Services Single-Session Mode (HSMS- SS) |
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SEMI E37.2- 95 |
High-Speed SECS Message Services General Session (HSMS- GS) |
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SEMI E37- 0298 |
High-Speed SECS Message Services (HSMS) Generic Services |
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SEMI E38.1- 95 |
Communications Environment HSMS/SECS-II for Cluster Tool Module Communications |
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SEMI E38- 1296 |
Cluster Tool Module Communications (CTMC) |
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SEMI E39.1- 1296 |
SECS-II Protocol for Object Services Standard (OSS) |
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SEMI E39- 0697 |
Object Services Standard: Concepts, Behavior, and Services |
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SEMI E40.1- 0996 |
SECS-II Support for Processing Management Standard |
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SEMI E4- 0699 |
SEMI Equipment Communications Standard 1 Message Transfer (SECS-I) |
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SEMI E40- 96 |
Standard for Processing Management |
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SEMI E41.1- 0996 |
SECS-II Support for the Exception Management Standard |
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SEMI E41- 95 |
Exception Management (EM) Standard |
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SEMI E42.1- 0997 |
Standard for SECS-II Protocol for Recipe Management Standard (RMS) |
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SEMI E42- 0299 |
Recipe Management Standard: Concepts, Behavior, and Message Services |
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SEMI E43- 95 |
Recommended Practice for Measuring Static Charge on Objects and Surfaces |
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SEMI E44- 96 |
Guide for Procurement and Acceptance of Minienvironments |
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SEMI E45- 95 |
Test Method for the Determination of Inorganic Contamination from Minienvironments |
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SEMI E46- 95 |
Test Method for the Determination of Organic Contamination from Minienvironments |
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SEMI E47.1- 0699 |
Provisional Mechanical Specification for Boxes and Pods Used to Transport and Store 300-mm Wafers |
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SEMI E47- 95 |
Specification for 150 mm/200 mm Pod Handles |
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SEMI E48- 95 |
Specification for SMIF Indexer Volume Requirement |
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SEMI E49.1- 95 |
Guide for Tool Final Assembly, Packaging, and Delivery |
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SEMI E49.2- 0298 |
Guide for High Purity Deionized Water and Chemical Distribution Systems in Semiconductor Manufacturing Equipment |
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SEMI E49.3- 0298 |
Guide for Ultrahigh Purity Deionized Water and Chemical Distribution Systems in Semiconductor Manufacturing Equipment |
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SEMI E49.4- 0298 |
Guide for High Purity Solvent Distribution Systems in Semiconductor Manufacturing Equipment |
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SEMI E49.5- 0298 |
Guide for Ultrahigh Purity Solvent Distribution Systems in Semiconductor Manufacturing Equipment |
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SEMI E49.6- 95 |
Guide for Subsystem Assembly and Testing Procedures - Stainless Steel Systems |
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SEMI E49.7- 95 |
Guide for Subsystem Assembly and Testing Procedures - Polymer Systems |
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SEMI E49.8- 0298 |
Guide for High Purity Gas Distribution Systems in Semiconductor Manufacturing Equipment |
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SEMI E49.9- 0298 |
Guide for Ultrahigh Purity Gas Distribution Systems in Semiconductor Manufacturing Equipment |
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SEMI E49- 95 |
Guide for Standard Performance, Practices, and Sub-Assembly for High Purity Piping Systems and Final Assembly for Semiconductor Manufacturing Equipment |
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SEMI E5- 0699 |
SEMI Equipment Communications Standard 2 Message Content (SECS-II) |
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SEMI E50- 95 |
Integrated SMIF Indexer Application Model for the Sensor/Actuator Network |
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SEMI E51- 0298 |
Guide for Typical Facilities Services and Termination Matrix |
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SEMI E52- 0298 |
Practice for Referencing Gases Used in Digital Mass Flow Controllers |
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SEMI E53.1- 1296 |
SECS-II Support for Event Reporting Standard |
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SEMI E53- 1296 |
Event Reporting |
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SEMI E54.1- 0299 |
Standard for Sensor/Actuator Network Common Device Model |
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SEMI E54.2- 0698 |
Guide for Writing Sensor/Actuator Network (SAN) Standard Ballots |
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SEMI E54.3- 0698 |
Specification for Sensor/Actuator Network Specific Device Model for Mass Flow Device |
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SEMI E54.4- 0997 |
Standard for Sensor/Actuator Network Communications for Devicenet- Previously Designated as SEMI E59: 0697 |
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SEMI E54.5- 0997 |
Standard for Sensor/Actuator Network Communications for the Smart Distributed System (SDS)-Previously Designated as SEMI E60: 0697 |
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SEMI E54.6- 0997 |
Standard for Sensor/Actuator Network Communications for Lonworks- Previously Designated as SEMI E61: 0697 |
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SEMI E54.7- 0699 |
Standard for Sensor/Actuator Network Communication for Seriplex |
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SEMI E54- 0997 |
Sensor/Actuator Network Standard |
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SEMI E56- 1296 |
Test Method for Determining Accuracy, Linearity, Repeatability, Short- Term Reproducibility, Hysteresis, and Deadband of Thermal Mass Flow Controllers |
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SEMI E57- 0299 |
Provisional Mechanical Specification for Kinematic Couplings Used to Align and Support 300 mm Wafer Carriers |
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SEMI E58.1- 0697 |
SECS-II Protocol for Automated Reliability, Availability, and Maintainability Standard (ARAMS): Concepts, Behavior, and Services |
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SEMI E58- 0697 |
Automated Reliability, Availability, and Maintainability Standard (ARAMS): Concepts, Behavior, and Services |
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SEMI E6- 1296 |
Facilities Interface Specifications Guideline and Format |
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SEMI E62- 0299 |
Provisional Specification for 300-mm Front-Opening Interface Mechanical Standard (FIMS) |
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SEMI E63- 0699 |
Provisional Mechanical Specification for 300-mm Box Opener/Loader to Tool Standard (Bolts-M) Interface |
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SEMI E64- 0698 |
Provisional Specification for 300 mm Cart to SEMI E15.1 Docking Interface Port |
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SEMI E66- 0997 |
Test Method for Determining Particle Contribution by Mass Flow Controllers |
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SEMI E67- 0997 |
Test Method for Determining Reliability of Mass Flow Controller |
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SEMI E68- 0997 |
Test Method for Determining Warm-Up Time of Mass Flow Controllers |
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SEMI E69- 0298 |
Test Method for Determining Reproducibility and Zero Drift for Thermal Mass Flow Controllers |
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SEMI E70- 0698 |
Guide for Tool Accommodation Process |
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SEMI E72- 0699 |
Provisional Specification and Guide for 300-mm Equipment Footprint, Height, and Weight |
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SEMI E73- 0299 |
Specification for Vacuum Pump Interfaces - Dry Pumps |
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SEMI E74- 0299 |
Specification for Vacuum Pump Interfaces - Turbomolecular Pumps |
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SEMI E75- 0698 |
Provisional Mechanical Specification for Box/Pod Compatible Cassettes Used to Transport and Store 300-mm Wafers |
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SEMI E76- 0299 |
Guide for 300-mm Process Equipment Points of Connection to Facility Services |
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SEMI E77- 0998 |
Test Method for Calculation of Conversion Factors for a Mass Flow Controller Using Surrogate Gases |
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SEMI E78- 0998 |
Electrostatic Compatibility - Guide to Assess and Control Electrostatic Discharge (ESD) and Electrostatic Attraction (ESA) for Equipment |
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SEMI E79- 0299 |
Standard for Definition and Measurement of Equipment Productivity |
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SEMI E7- 91 |
Specification for Electrical Interfaces for the U.S. Only |
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SEMI E80- 0299 |
Test Method for Detremining Attitude Sensitivity of Mass Flow Controllers (Mounting Position) |
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SEMI E81- 0699 |
Provisional Specification for CIM Framework Domain Architecture |
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SEMI E83- 0699 |
Provisional Specification for 300mm PGV Mechanical Docking Flange |
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SEMI E84- 0699 |
Specification for Enhanced Carrier Handoff Parallel I/O Interface |
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SEMI E85- 0699 |
Provisional Specification for Physical AMHS Stocker to Interbay Transport System Interoperability |
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SEMI E8- 92 |
Specification Wafer Transport Systems: Interface Coordinates |
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SEMI F- 0699 |
Facility Standards and Safety Guidelines |
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SEMI F10- 0698 |
Test Method to Determine the Internal Pressure Required to Produce a Failure of a Tube Fitting Connection Made of Fluorocarbon Materials |
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SEMI F11- 0998 |
Test Method to Obtain an Indication of the Thermal Characteristics of Tube Fitting Connections Made of Fluorocarbon Materials |