SEMI - Semiconductor Equipment and Materials International


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Description:
SEMI is the global industry association serving the advanced manufacturing supply chain. Semiconductor Equipment and Materials International (SEMI) is a trade organization of manufacturers of equipment and materials used in the fabrication of semiconductor devices such as integrated circuits, transistors, diodes, and thyristors. A global industry association serving the advanced manufacturing supply chain, SEMI acts as a clearinghouse for the generation of electronic standards. The documents within the SEMI give guidance on the chemical and material processes involved in the manufacture of semiconductor "chips" and other related devices. 

Standards from this Collection.

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SEMI AUX1- 0699

List of Vendor Identification Codes

SEMI C1.21- 92

Standard for Xylenes

SEMI C10- 0299

Guide for Determination of Method Detection Limits

SEMI C13- 95

Test Method for Particle Shedding and Penetration Performance of Point- of-Use Gas Filters

SEMI C14- 95

Test Method for Particle Shedding Performance of 25 cm Gas Filter Cartridges

SEMI C15- 95

Test Method for PPM and PPB Humidity Standards

SEMI C16- 0299

Guide for Precision and Data Reporting Practices

SEMI C18- 0699

Specification for Acetic Acid

SEMI C19- 0699

Specification for Acetone

SEMI C1- 95

Specifications for Reagents

SEMI C20- 0699

Specification and Guidelines for Ammonium Fluoride 40%

SEMI C21- 0699

Specifications and Guideline for Ammonium Hydroxide

SEMI C22- 0699

Guideline for Boron Tribromide

SEMI C23- 0699

Specifications for Buffered Oxide Etchants

SEMI C24- 0699

Specification for n-Butyl Acetate

SEMI C25- 0699

Specification for Dichloromethane (Methylene Chloride)

SEMI C26- 0699

Specification and Guideline for Hexamethyldisilazane (HMDS)

SEMI C27- 0699

Specifications and Guidelines for Hydrochloric Acid

SEMI C28- 0699

Specifications and Guidelines for Hydrofluoric Acid

SEMI C29- 0699

Specifications and Guidelines for 4.9% Hydrofluoric Acid (10:1 v/v)

SEMI C2- 95

Specifications for Etchants

SEMI C3.10- 95

Standard for Silane (SiH4) (Provisional)

SEMI C3.11- 93

Standard for Silicon Tetrachloride (SiCl4) in Cylinders (Provisional)

SEMI C3.12- 94

Standard for Ammonia (NH3) in Cylinders, 99.998% Quality

SEMI C3.13- 93

Standard for Nitrous Oxide (N2O) in Cylinders, 99.997% Quality

SEMI C3.14- 94

Standard for Argon (Ar), in Cylinders, 99.998% Quality

SEMI C3.15- 93

Standard for Nitrogen (N2) in Cylinders, 99.9992% Quality

SEMI C3.16- 95

Standard for Oxygen (O2) in Cylinders, 99.50% Assay

SEMI C3.18- 94

Standard for Dichlorosilane (H2SiCl2) in Cylinders, 97% Quality

SEMI C3.1- 93

Standard for Argon (Ar), Bulk Liquid, 99.998% Quality

SEMI C3.19- 93

Standard for Hydrogen (H2) in Cylinders, 99.9995% Quality

SEMI C3.20- 92

Standard for Helium (He) in Cylinders, 99.9995% Quality

SEMI C3.21- 90

Standard for Carbon Tetrafluoride (CF4) in Cylinders (Provisional)

SEMI C3.22- 93

Standard for Oxygen (O2), Bulk Liquid, 99.5% Quality

SEMI C3.23- 95

Standard for Oxygen (O2) in Cylinders, 99.98% Quality

SEMI C3.24- 95

Standard for Sulfur Hexafluoride (SF6) in Cylinders, 99.97% Quality

SEMI C3.26- 94

Standard for Tungsten Hexafluoride (WF6) in Cylinders, 99.8% Quality

SEMI C3.27- 94

Standard for Boron Trifluoride (BF3) in Cylinders, 99.0% Quality

SEMI C3.28- 92

Standard for Nitrogen (N2), VLSI Grade in Cylinders

SEMI C3.2- 92

Standard for Arsine (AsH3) in Cylinders

SEMI C3.29- 96

Standard for Nitrogen (N2), Bulk Gaseous, 99.9995% Quality

SEMI C3.30- 96

Standard for Hydrogen (H2), Bulk, 99.9997% Quality

SEMI C3.31- 94

Standard for Dichlorosilane (H2SiCl2) in Cylinders, 99% Quality (Provisional)

SEMI C3.32- 95

Standard for Chlorine (Cl2), 99.996% Quality

SEMI C3.33- 92

Standard for Boron Trichloride (BCI3) (Provisional)

SEMI C3.34- 92

Standard for Disilane (Si2H6)

SEMI C3.35- 95

Standard for Hydrogen Chloride (HCl), 99.997% Quality (Provisional)

SEMI C3.36- 94

Standard for Hydrogen Chloride (HCl), 99.994% Quality (Provisional)

SEMI C3.37- 93

Standard for Hexafluoroethane (C2F6), 99.97% Quality

SEMI C3.38- 89

Standard for Tungsten Hexafluoride (WF6), VLSI Grade (Provisional)

SEMI C3.39- 91

Standard for Nitrogen Trifluoride (NF3) (Provisional)

SEMI C3.40- 92

Standard for Carbon Tetrafluoride (CF4), VLSI Grade (Provisional)

SEMI C3.41- 0697

Standard for Oxygen (O2), Bulk, 99.9998% Quality (Provisional)

SEMI C3.42- 90

Standard for Argon (Ar), VLSI Grade Bulk (Provisional)

SEMI C3.43- 90

Standard for Hydrogen Fluoride (HF), Anhydrous (Provisional)

SEMI C3.44- 91

Standard for Diborane (B2H6) (Provisional)

SEMI C3.45- 92

Standard for Hexafluoroethane (C2F6), 99.996% Quality (Provisional)

SEMI C3.46- 93

Standard for Argon (Ar), Bulk Liquid, 99.9992% Quality

SEMI C3.47- 95

Standard for Hydrogen Bromide (HBr), 99.98% Quality

SEMI C3.48- 93

Standard for Nitrogen (N2), Bulk Liquid, 99.9994% Quality

SEMI C3.4- 93

Standard for Hydrogen (H2), Bulk Liquid, 99.9995% Quality

SEMI C3.49- 94

Standard for Bulk Nitrogen (N2), 99.99999% Quality

SEMI C3.50- 95

Standard for Nitrous Oxide (N2O), 99.9994% Quality (Provisional)

SEMI C3.51- 95

Standard for Boron Trichloride (BCl3), 99.98% Quality

SEMI C3.52- 95

Standard for Tungsten Hexafluoride, 99.996% Quality

SEMI C3.53- 95

Standard for Trifluoromethane (CHF3), 99.95% Quality

SEMI C3.54- 0697

Gas Purity Guideline for Silane (SiH4)

SEMI C3.5- 93

Standard for Nitrogen (N2), Bulk Liquid, 99.998% Quality

SEMI C3.6- 95

Standard for Phosphine (PH3) in Cylinders, 99.98% Quality (Provisional)

SEMI C30- 0699

Specifications and Guidelines for Hydrogen Peroxide

SEMI C3- 0699

Specifications for Gases

SEMI C31- 0699

Specification for Methanol

SEMI C32- 0699

Specification for Methyl Ethyl Ketone

SEMI C33- 0699

Specifications for n-Methyl 2-Pyrrolidone

SEMI C34- 0699

Specification and Guideline for Mixed Acid Etchants

SEMI C35- 0699

Specifications and Guideline for Nitric Acid

SEMI C36- 0699

Specifications and Guidelines for Phosphoric Acid

SEMI C37- 0699

Specification for Phosphoric Etchants

SEMI C38- 0699

Guideline for Phosphorus Oxychloride

SEMI C39- 0699

Specification for Potassium Hydroxide Pellets

SEMI C40- 0699

Specification for Potassium Hydroxide, 45% Solution

SEMI C41- 0699

Specifications and Guidelines for 2-Propanol

SEMI C42- 0699

Specification for Sodium Hydroxide Pellets

SEMI C43- 0699

Specification for Sodium Hydroxide, 50% Solution

SEMI C44- 0699

Specifications and Guidelines for Sulfuric Acid

SEMI C45- 0699

Specification and Guideline for Tetraethylorhosilicate (TEOS)

SEMI C46- 0699

Guideline for 25% Tetramethylammonium Hydroxide

SEMI C47- 0699

Guideline for Trans 1,2 Dichloroethylene

SEMI C48- 0699

Specification and Guideline for 1,1,1-Trichloroethane, Furnace Grade

SEMI C49- 0699

Guideline for Trimethylborate

SEMI C50- 0699

Guideline for Trimethylphosphite

SEMI C51- 0699

Specification for Xylenes

SEMI C6.2- 93

Particle Specification for Grade 20/0.02 Oxygen Delivered as Pipeline Gas

SEMI C6.3- 89

Particle Specification for Grade 20/0.2 Hydrogen (H2) Delivered as Pipeline Gas

SEMI C6.4- 90

Particle Specification for Grade 20/0.02 Nitrogen (N2) and Argon (Ar) Delivered as Pipeline Gas

SEMI C6.5- 90

Particle Specification for Grade 10/0.2 Nitrogen (N2) and Argon (Ar) Delivered as Pipeline Gas

SEMI C6.6- 90

Particle Specification for Grade 10/0.1 Nitrogen (N2) and Argon (AR) Delivered as Pipeline Gas

SEMI C6.7- 93

Particle Specification for Grade 10/0.2 Nitrogen in High Pressure Gas Cylinders

SEMI C9.1- 93

Guide for Analysis of Uncertainties in Gravimetrically Prepared Gas Mixtures

SEMI COMM

Committee Descriptions and Current Development Activity; Regional Standards Committee Lists

SEMI COPY

SEMI Copyright Information

SEMI D10- 95

Test Method for Chemical Durability of Flat Panel Display Glass Substrates

SEMI D11- 95

Specification for Flat Panel Display Glass Substrate Cassettes

SEMI D12- 95

Specification for Edge Condition of Flat Panel Display (FPD) Substrates

SEMI D13- 95

Terms and Definitions for FPD Color Filter Assemblies

SEMI D14- 96

Specification for Image Field Stitching Capabilities of FPD Steppers

SEMI D15- 1296

FPD Glass Substrate Surface Waviness Measurement Method

SEMI D16- 0998

Specification for Mechanical Interface Between Flat Panel Display Material Handling System and Tool Port

SEMI D17- 0998

Mechanical Specification for Cassettes Used to Ship Flat Panel Display Glass Substrates

SEMI D18- 0299

Specification for Cassettes Used for Horizontal Transport and Storage of Flat Panel Display Substrates

SEMI D19- 0299

Test Method for the Determination of Chemical Resistance of Flat Panel Display Color Filters

SEMI D3- 91

Quality Area Specification for Flat Panel Display Substrates

SEMI D4- 94

Method for Referencing Flat Panel Display Substrates

SEMI D5- 94

Standard Size for Flat Panel Display Substrates

SEMI D6- 0699

Specification for Edge Length and Thickness for Flat Panel Display Mask Substrates

SEMI D7- 94

FPD Glass Substrate Surface Roughness Measurement Method

SEMI D8- 94

Specification for Overlay Capabilities of FPD Steppers

SEMI D9- 94

Definitions for Flat Panel Display Substrates

SEMI DEF MASKS

Definitions for Flat Panel Display Masks

SEMI DEFECT TERM

Defect Terminology for FPD Masks

SEMI E/H- 0699

Equipment Automation/Hardware Volume

SEMI E/S 1- 0699

Equipment Automation/Software Volume 1

SEMI E/S 2- 0699

Equipment Automation/Software Volume 2

SEMI E1.1- 0697

Standard for 3 Inch Plastic and Metal Wafer Carriers, General Usage

SEMI E1.2- 0697

Standard for 100 mm Plastic and Metal Wafer Carriers, General Usage

SEMI E1.3- 0697

Standard for 125 mm Plastic and Metal Wafer Carriers, General Usage

SEMI E1.4- 0697

Standard for 125 mm Plastic and Metal Wafer Carriers, Auto Transport Usage

SEMI E1.5- 91

Standard for 150 mm Plastic and Metal Wafer Carriers, General Usage

SEMI E1.9- 0699

Provisional Mechanical Specification for Cassettes Used to Transport and Store 300-mm Wafers

SEMI E10- 0699

Standard for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM)

SEMI E1- 0697

Specification for 3 Inch, 100 mm, 125 mm, and 150 mm Plastic and Metal Wafer Carriers

SEMI E11- 0697

Guideline for 125 mm, 150 mm, and 200 mm Plastic and Metal Wafer Carrier Application

SEMI E12- 96

Standard for Standard Pressure, Temperature, Density, and Flow Units Used in Mass Flow Meters and Mass Flow Controllers

SEMI E13- 91

Standard for SEMI Equipment Communication Standard Message Service (SMS)-NOTE: This document was balloted and approved for withdrawal in 1995

SEMI E14- 93

Measurement of Particle Contamination Contributed to the Product from the Process or Support Tool

SEMI E15.1- 0699

Provisional Specification for 300 mm Tool Load Port

SEMI E15- 0698

Specification for Tool Load Port

SEMI E16- 90

Guideline for Determining and Describing Mass Flow Controller Leak Rates

SEMI E17- 91

Guideline for Mass Flow Controller Transient Characteristics Tests

SEMI E18- 91

Guideline for Temperature Specifications of the Mass Flow Controller

SEMI E19.1- 0697

Port Standard for Mechanical Interface of Wafer Cassette Transfer, 100 mm (4 Inch) Port

SEMI E19.2- 0697

Port Standard for Mechanical Interface of Wafer Cassette Transfer, 125 mm (5 Inch) Port

SEMI E19.3- 0697

Port Standard for Mechanical Interface of Wafer Cassette Transfer, 150 mm (6 Inch) Port

SEMI E19.4- 0998

200 mm Standard Mechanical Interface (SMIF)

SEMI E19.5- 0996

Specification for 300 mm Bottom-Opening Standard Mechanical Interface (SMIF)

SEMI E19- 0697

Standard Mechanical Interface (SMIF)

SEMI E2.2- 93

Standard for 200 mm Quartz and High Temperature Wafer Carriers

SEMI E2.3- 93

Standard for 100 mm Quartz and High Temperature Wafer Carriers

SEMI E2.4- 93

Standard for 125 mm Quartz and High Temperature Wafer Carriers

SEMI E2.5- 93

Standard for 150 mm Quartz and High Temperature Wafer Carriers

SEMI E20- 0697

Cluster Tool Module Interface: Electrical Power and Emergency Off Standard

SEMI E21.1- 1296

Cluster Tool Module Interface 300 mm: Mechanical Interface and Wafer Transport Standard

SEMI E21- 94

Cluster Tool Module Interface: Mechanical Interface and Wafer Transport Standard

SEMI E22.1- 1296

Cluster Tool Module Interface 300 mm: Transport Module End Effector Exclusion Volume Standard

SEMI E22- 0697

Cluster Tool Module Interface: Transport Module End Effector Exclusion Volume Standard

SEMI E23- 96

Specification for Cassette Transfer Parallel I/O Interface

SEMI E24- 92

Cluster Tool Module Interface: Isolation Valve Interlocks Standard

SEMI E25- 92

Cluster Tool Module Interface: Module Access Guideline

SEMI E26.1- 92

Radial Cluster Tool Footprint 300 mm Standard

SEMI E26- 92

Radial Cluster Tool Footprint Standard

SEMI E27- 92

Standard for Mass Flow Controller and Mass Flow Meter Linearity

SEMI E28- 92

Guideline for Pressure Specifications of the Mass Flow Controller

SEMI E2- 93

Specifications for Quartz and High Temperature Wafer Carriers

SEMI E29- 93

Standard Terminology for the Calibration of Mass Flow Controllers and Mass Flow Meters

SEMI E30.1- 0698

Inspection and Review Specific Equipment Model (ISEM)

SEMI E30.2- 0698

Handler Equipment Specific Equipment Model (HSEM)

SEMI E30.3- 0698

Testing Equipment Specific Equipment Model (TSEM)

SEMI E30.4- 0699

Intrabay AMHS SEM Specification (IBSEM)

SEMI E30- 0299

Generic Model for Communications and Control of SEMI Equipment (GEM)

SEMI E31- 93

Specification for Electrical Interface, Japan Only

SEMI E32.1- 0997

SECS-II Support for Material Movement

SEMI E32- 0997

Material Movement Management (MMM)

SEMI E33- 94

Specification for Semiconductor Manufacturing Facility Electromagnetic Compatibility

SEMI E34- 95

Guideline for Mass Flow Device Return

SEMI E35.1- 95

Guide for Cost of Equipment Ownership Comparison Metric

SEMI E35- 0299

Cost of Ownership for Semiconductor Manufacturing Equipment Metrics

SEMI E36- 0699

Semiconductor Equipment Manufacturing Information Tagging Specification

SEMI E37.1- 96

High-Speed SECS Message Services Single-Session Mode (HSMS- SS)

SEMI E37.2- 95

High-Speed SECS Message Services General Session (HSMS- GS)

SEMI E37- 0298

High-Speed SECS Message Services (HSMS) Generic Services

SEMI E38.1- 95

Communications Environment HSMS/SECS-II for Cluster Tool Module Communications

SEMI E38- 1296

Cluster Tool Module Communications (CTMC)

SEMI E39.1- 1296

SECS-II Protocol for Object Services Standard (OSS)

SEMI E39- 0697

Object Services Standard: Concepts, Behavior, and Services

SEMI E40.1- 0996

SECS-II Support for Processing Management Standard

SEMI E4- 0699

SEMI Equipment Communications Standard 1 Message Transfer (SECS-I)

SEMI E40- 96

Standard for Processing Management

SEMI E41.1- 0996

SECS-II Support for the Exception Management Standard

SEMI E41- 95

Exception Management (EM) Standard

SEMI E42.1- 0997

Standard for SECS-II Protocol for Recipe Management Standard (RMS)

SEMI E42- 0299

Recipe Management Standard: Concepts, Behavior, and Message Services

SEMI E43- 95

Recommended Practice for Measuring Static Charge on Objects and Surfaces

SEMI E44- 96

Guide for Procurement and Acceptance of Minienvironments

SEMI E45- 95

Test Method for the Determination of Inorganic Contamination from Minienvironments

SEMI E46- 95

Test Method for the Determination of Organic Contamination from Minienvironments

SEMI E47.1- 0699

Provisional Mechanical Specification for Boxes and Pods Used to Transport and Store 300-mm Wafers

SEMI E47- 95

Specification for 150 mm/200 mm Pod Handles

SEMI E48- 95

Specification for SMIF Indexer Volume Requirement

SEMI E49.1- 95

Guide for Tool Final Assembly, Packaging, and Delivery

SEMI E49.2- 0298

Guide for High Purity Deionized Water and Chemical Distribution Systems in Semiconductor Manufacturing Equipment

SEMI E49.3- 0298

Guide for Ultrahigh Purity Deionized Water and Chemical Distribution Systems in Semiconductor Manufacturing Equipment

SEMI E49.4- 0298

Guide for High Purity Solvent Distribution Systems in Semiconductor Manufacturing Equipment

SEMI E49.5- 0298

Guide for Ultrahigh Purity Solvent Distribution Systems in Semiconductor Manufacturing Equipment

SEMI E49.6- 95

Guide for Subsystem Assembly and Testing Procedures - Stainless Steel Systems

SEMI E49.7- 95

Guide for Subsystem Assembly and Testing Procedures - Polymer Systems

SEMI E49.8- 0298

Guide for High Purity Gas Distribution Systems in Semiconductor Manufacturing Equipment

SEMI E49.9- 0298

Guide for Ultrahigh Purity Gas Distribution Systems in Semiconductor Manufacturing Equipment

SEMI E49- 95

Guide for Standard Performance, Practices, and Sub-Assembly for High Purity Piping Systems and Final Assembly for Semiconductor Manufacturing Equipment

SEMI E5- 0699

SEMI Equipment Communications Standard 2 Message Content (SECS-II)

SEMI E50- 95

Integrated SMIF Indexer Application Model for the Sensor/Actuator Network

SEMI E51- 0298

Guide for Typical Facilities Services and Termination Matrix

SEMI E52- 0298

Practice for Referencing Gases Used in Digital Mass Flow Controllers

SEMI E53.1- 1296

SECS-II Support for Event Reporting Standard

SEMI E53- 1296

Event Reporting

SEMI E54.1- 0299

Standard for Sensor/Actuator Network Common Device Model

SEMI E54.2- 0698

Guide for Writing Sensor/Actuator Network (SAN) Standard Ballots

SEMI E54.3- 0698

Specification for Sensor/Actuator Network Specific Device Model for Mass Flow Device

SEMI E54.4- 0997

Standard for Sensor/Actuator Network Communications for Devicenet- Previously Designated as SEMI E59: 0697

SEMI E54.5- 0997

Standard for Sensor/Actuator Network Communications for the Smart Distributed System (SDS)-Previously Designated as SEMI E60: 0697

SEMI E54.6- 0997

Standard for Sensor/Actuator Network Communications for Lonworks- Previously Designated as SEMI E61: 0697

SEMI E54.7- 0699

Standard for Sensor/Actuator Network Communication for Seriplex

SEMI E54- 0997

Sensor/Actuator Network Standard

SEMI E56- 1296

Test Method for Determining Accuracy, Linearity, Repeatability, Short- Term Reproducibility, Hysteresis, and Deadband of Thermal Mass Flow Controllers

SEMI E57- 0299

Provisional Mechanical Specification for Kinematic Couplings Used to Align and Support 300 mm Wafer Carriers

SEMI E58.1- 0697

SECS-II Protocol for Automated Reliability, Availability, and Maintainability Standard (ARAMS): Concepts, Behavior, and Services

SEMI E58- 0697

Automated Reliability, Availability, and Maintainability Standard (ARAMS): Concepts, Behavior, and Services

SEMI E6- 1296

Facilities Interface Specifications Guideline and Format

SEMI E62- 0299

Provisional Specification for 300-mm Front-Opening Interface Mechanical Standard (FIMS)

SEMI E63- 0699

Provisional Mechanical Specification for 300-mm Box Opener/Loader to Tool Standard (Bolts-M) Interface

SEMI E64- 0698

Provisional Specification for 300 mm Cart to SEMI E15.1 Docking Interface Port

SEMI E66- 0997

Test Method for Determining Particle Contribution by Mass Flow Controllers

SEMI E67- 0997

Test Method for Determining Reliability of Mass Flow Controller

SEMI E68- 0997

Test Method for Determining Warm-Up Time of Mass Flow Controllers

SEMI E69- 0298

Test Method for Determining Reproducibility and Zero Drift for Thermal Mass Flow Controllers

SEMI E70- 0698

Guide for Tool Accommodation Process

SEMI E72- 0699

Provisional Specification and Guide for 300-mm Equipment Footprint, Height, and Weight

SEMI E73- 0299

Specification for Vacuum Pump Interfaces - Dry Pumps

SEMI E74- 0299

Specification for Vacuum Pump Interfaces - Turbomolecular Pumps

SEMI E75- 0698

Provisional Mechanical Specification for Box/Pod Compatible Cassettes Used to Transport and Store 300-mm Wafers

SEMI E76- 0299

Guide for 300-mm Process Equipment Points of Connection to Facility Services

SEMI E77- 0998

Test Method for Calculation of Conversion Factors for a Mass Flow Controller Using Surrogate Gases

SEMI E78- 0998

Electrostatic Compatibility - Guide to Assess and Control Electrostatic Discharge (ESD) and Electrostatic Attraction (ESA) for Equipment

SEMI E79- 0299

Standard for Definition and Measurement of Equipment Productivity

SEMI E7- 91

Specification for Electrical Interfaces for the U.S. Only

SEMI E80- 0299

Test Method for Detremining Attitude Sensitivity of Mass Flow Controllers (Mounting Position)

SEMI E81- 0699

Provisional Specification for CIM Framework Domain Architecture

SEMI E83- 0699

Provisional Specification for 300mm PGV Mechanical Docking Flange

SEMI E84- 0699

Specification for Enhanced Carrier Handoff Parallel I/O Interface

SEMI E85- 0699

Provisional Specification for Physical AMHS Stocker to Interbay Transport System Interoperability

SEMI E8- 92

Specification Wafer Transport Systems: Interface Coordinates

SEMI F- 0699

Facility Standards and Safety Guidelines

SEMI F10- 0698

Test Method to Determine the Internal Pressure Required to Produce a Failure of a Tube Fitting Connection Made of Fluorocarbon Materials

SEMI F11- 0998

Test Method to Obtain an Indication of the Thermal Characteristics of Tube Fitting Connections Made of Fluorocarbon Materials